The CLM-3D 300 mm DualBeam is a full wafer autoloading system for automated digital 3D analysis of semiconductor devices in a clean room environment. It combines FEI's latest-generation electron column and high current ion column to provide high precision cross-sectional metrology. By quickly providing critical feedback in-line, the CLM-3D delivers real-time process characterization or validation.

The CLM-3D delivers 3D metrology information that helps semiconductor manufacturers meet the need for rapid prototyping, process control, increased productivity and higher yields.It automatically mills cross sections and acquires high-resolution SEM images; IC3D metrology software extracts critical dimensions for 3D structures for fast, precise characterization. The CLM-3D is fab ready, with anti-vibration and EM field cancellation, buffered loading and the ability to process 200 mm and 300 mm wafers